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Lightspring secures, 3.5M to address 50% cost bottleneck in photonic chips

Lightspring secures, 3.5M to address 50% cost bottleneck in photonic chips
Tima Miroshnichenko · pexels

Besançon-based startup Lightspring has closed a, 3.5 million seed round to industrialize the packaging of photonic integrated circuits. This capital injection targets the primary cost driver in optical hardware production, which currently accounts for half of…